1. 2. 3. material content data sheet sales product name tle42754e issued 28. august 2013 ma# MA001131782 package pg-ssop-14-2 weight* 83.54 mg construction element material group substances cas# if applicable weight [mg] average mass [%] sum [%] average mass [ppm] sum [ppm] chip inorganic material silicon 7440-21-3 3.311 3.96 3.96 39639 39639 leadframe inorganic material phosphorus 7723-14-0 0.009 0.01 103 non noble metal zinc 7440-66-6 0.034 0.04 412 non noble metal iron 7439-89-6 0.689 0.82 8248 non noble metal copper 7440-50-8 27.978 33.49 34.36 334911 343674 wire noble metal gold 7440-57-5 0.131 0.16 0.16 1566 1566 encapsulation organic material carbon black 1333-86-4 0.096 0.12 1151 plastics epoxy resin - 4.421 5.29 52925 inorganic material silicondioxide 60676-86-0 43.540 52.13 57.54 521192 575268 leadfinish non noble metal tin 7440-31-5 0.976 1.17 1.17 11685 11685 plating noble metal silver 7440-22-4 0.768 0.92 0.92 9189 9189 glue plastics epoxy resin - 0.396 0.47 4745 noble metal silver 7440-22-4 1.189 1.42 1.89 14234 18979 *deviation < 10% sum in total: 100,00 1000000 important remarks: infineon technologies ag provides full material declaration based on information provided by third parties and has taken and continues to take reasonable steps to provide representative and accurate information. infineon technologies ag and infineon technologies ag suppliers consider certain information to be proprietary, and thus cas numbers and other limited information may not be available for release. all statements are based on our present knowledge, are provided 'as is' and may be subject to change at any time due to technical requirements and development without notification. company infineon technologies ag address 81726 mnchen internet www.infineon.com
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